Description
0.008mm 50M/200M Silver Jumper Wire for Mobile Phone Motherboard Chip Welding Repair PCB Repair Link Wire Soldering Tool
Description:
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Mobile Phone Motherboard Repair BGA Desoldering wire
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Absorption wire Soldering Accessory assistant for removing unwanted solder Quickly.
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Sucking line BGA Desoldering Solder Wire BGA Tin Absorption line.
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Desoldering Wire Solder wick Except for the tin absorbing excess solder.
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Silver BGA Desoldering wire - Quickly removes unwanted solder
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When used with a soldering iron, improve Your mobile phone PCB Desoldering Process.
Features:
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High efficiency and save the electric repairing time.
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Avoid the high temperature destruction of electric pad.
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Design in precision,guarantee the max surface tension and the ability of absorbing tin.
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Speed up the speed of absorbing tin and low residue of flux.
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Increase the speed of cleaning the PCB pad.
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Oxidation resistivity and anti-corrosion protection,good thermal conductivity.