Description
Repairing the motherboard of the iPhone X-15 Pro Max requires a preheating platform with a mechanical heat air consistent temperature desoldering. Multi-layer mobile phone motherboard desoldering station with intelligent mechanic heat air, degumming, tin planting, lamination, delamination, reflow welding, desoldering, and soldering repair capabilities.
Details:
Mechanic Heat Air Desoldering Station is its name.
Voltage input: AC 100V/240V.
600W of output power.
Dimensions: 178*101*45 mm.
260°C is the tempera
Setting time: 10s to 990s.
Standard packing list: box, power wire, host, and common module.
Optional:
1. A heating module for the iPhone X-11 Pro Max with five reballing stencils.
2. A heating module for the iPhone 12 series with three reballing stencils.
3. A heating module with four reballing stencils for the iPhone 13 series.
4. Three reballing stencils and a heating module for the iPhone 14 series
5. A heating module for the iPhone 15 series that comes with two reballing stencils.
Features include:
1. A mechanical desoldering station with a constant temperature timing for repairing cell phone motherboards, including glue removal, tin planting, lamination, layering, reflow, desoldering, and soldering.
2. One important intelligent bonding/separation function. dependable and safe.will not result in the phenomenon of a tin explosion.
3. The heating platform heats up rapidly in just 60 seconds. It can effortlessly finish layered tasks in 180 seconds.
4. The motherboard won't be harmed while operating thanks to the high temperature protection feature and intelligent temperature control system. to give consumers a heating experience that is both safe and effective.
5. A PTC heating core. incredibly quick heating up. Heat conduction materials and effective heating elements are used in the heating platform. guarantees quick heating in just one minute. with a maximum power input of 600W.
6. The 2.5-inch HD display on the Mechanic Heat Air heating platform makes it easy to see the current temperature. You can monitor the heating status with a countdown and three temperature memories.
7. When the temperature reaches the set value. the platform starts to maintain a constant temperature and countdown ends. That is automatic cooling. the buzzer prompts.
8. The temperature is displayed in real time and can be adjusted with a stepless dial.
9. Can store three common memory temperatures and quickly switch to set temperatures.
10. One click to switch the memory temperature. double-click to enter the time setting. adjust the setting time through the knob.
11. Double-sided heat dissipation. stable and not hot.
12. Built for the motherboard. high temperature and no blocking. make maintenance work more convenient.
13. Modularization and unlimited upgrade expansion.
14. Boot current fault data storage. current curve fault analysis can be checked.