Description
MiJing MS1-Mini Chip Glue Removal Platform for Mobile Phone Motherboard Chip IC Heating Rework Platform ic Desoldering Station
Rapid temperature rise
preset 160-250C temperature range, one-button adjustment
Concealed screw, low voltage heating plate, support 5V/9V power supply
Chip glue removal table
Features：
1.Rapid temperature rise
2.Aluminum substrate heat conduction faster and more efficient
3.Compact and portable ,easy to use
