Description
XZZ TR16 Middle Layer Frame Tin Planting Platform BGA Reballing Stencil for iPhone X 11 12 13 14 15 16Pro Max Motherboard Repair
Option:
1. XZZ TR Middle Frame BGA Plant Tin Platform for iphone X-14promax
2. XZZ TR Middle Frame BGA Plant Tin Platform for iphone X-15promax
3. Xinzhizao 16 series mold only.
4. XZZ TR Middle Frame BGA Plant Tin Platform for iphone X-16promax
Features:
1. Strong magnetic adsorption, built-in strong magnetic.
2. Non-disassembling, easy to use.
3. Position quickly.
4. High-temperature resistance and abrasion resistance imported alloy steel, metal fatigue resistance, make the product use more durable.
5. Imported alloy steel, high material, and technology, anti-fouling, easy to clean.
6. Suitable for iPhone A8 A9 A10 a11 A12 A13 A14 A15 CPU, iPhone X-14 Pro Max middle layer frame.
7. 0.1mm stencil: the square hole is completely pierced.
8. 0.12mm stencil: the square hole is not completely pierced.
9: Magnetic base, positioning plate, stencil.
Installation:
1. Separate the magnetic base and positioning plate, secure the IC to the corresponding position (needs to be consistent with the direction of the steel mesh).
2. Place the steel mesh directly on the slot (note that the mesh is aligned with the bottom chip).
3. Place the positioning plate on the magnetic base, the installation is complete.
4. Preheat the stencil with a hot air gun, and then blow it in the IC opening position.
