YCS-H03 Universal Mini Circular Fixture For Mobile Phone Motherboard Chip BGA Soldering Glue Removal Adjustable Repair Holder

YCS-H03 Universal Mini Circular Fixture For Mobile Phone Motherboard Chip BGA Soldering Glue Removal Adjustable Repair Holder

YCS Ring Clamps YCS-H03

Features:
Fully applicable to various types of chips/motherboards
Removal tin and glue, no need to adjust direction, Travel coaxial movement
iPhone Android Full Series IC Chip
Removal Glue/Tin Not blocking the knife.
Motherboard cleaning don't require adjusting orientation clean up at once.
the module is suitable for various sizes of motherboards in all aspects.


Product parameters:
Brand:YCS
Name:maintenance master circular Fixture 
Function:clamping various types of chips, motherboard, CPUs
Net weight:211g
Product size:104*22*90mm