Description
HMT-X1 2 in 1Motherboard Layered Chip Glue Removal Fixture Delamination and Degumming Heating Table for Phone Motherboard Repair
Description
HMT-X1/ZJ-X1 muti-functional motherboard layered chip glue removal heating table for motherboard layering/chip debonding tinning repair. HMT-X1 360W multifunctional motherboard delamination and degumming heating table, using German imported temperature control, can quickly heat for IP tinning and degumming motherboard delamination/glue removal mobile phone repair.
Features
1. Temperature control imported from Germany, rapid heating.
2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up.
3. Motherboard delamination / chip degumming, separation preheating / tinning.
4. Self-contained motherboard / chip fixing, compact and light.
5. Maximum temperature 260 degrees, free temperature adjustment, uniform heating.
6. Aluminum alloy panel, synthetic stone insulation, ceramic heating pad patented technology.
Specification
Product Model: HMT-X1.
Color options: Space Gray.
Working voltage: 110V/220V.
Maximum temperature: 260℃.
Product size: 170*125*75H.
Packing size: 190*160*120H.
Outer box size: 810*206*500H.
Product weight: 0.85kg.
FCL weight: 18.5kg.
