Description
LUOWEI HG-01 800W Hot Air Desoldering Station for Mobile Phone BGA Repair Smart Digital Display High Power Heating Platform
THE FOLLOWING TEMPERATURES ARE FOR REFERENCE ONLY AND CAN BE ADJUSTED ACCORDING TO DIFFERENT USAGE TECHNIQUES
CPU DISassembly
PREHEAT THE ENTIRE BOARD AT 60 AIRFLOW REMOVE ADHESIVE BY BLOWING AT 65
AND 300°C. AIRFLOW AND 370°C.REMOVE THE EDGE ADHESIVE AT 55 AIRFLOW
AND 360°C.
REMOVE THE CPU AT 80 AIRFLOW AND 380°C.
PREHEAT AT 50 AIRFLOW AND 310°C. RECOMMENDED SETTINGS: 65 AIRFLOW AT
REMOVE EDGE ADHESIVE AT 60 AIRFLOW 380°C, 70 AIRFLOW AT 360°C.
AND 360°C ADJUST ACCORDING TO YOUR PREFERENCE.
REMOVE THE FONT LIBRARY AT 80 AIRFLOW
AND 40°C.
MOTHERBOARD INLINE SOCKET
MID-LAYER ASSEMBLY INSTALLATION AND
AND DISASSEMBLY REMOVAL
WITHOUT THE NOZZLE. ASSEMBLY: USE 60 AIRFLOW AT 360°C.
ASSEMBLY: USE 70 AIRFLOW AT 380°C
WITHOUT THE NOZZLE.
POWER IC INSTALLATION NOTE:
AND REMOVAL
DISASSEMBLY: HEAT UNTIL THE SOLDER FULLY
DISASSEMBLY: USE 100 AIRFLOW AT 400°C, Lh ie CTE A CRIICOLORITWERCER
AND HOLD THE PRY TOOL IN PLACE. mAs
Se SORE ASSEMBLY: HEAT UNTIL SOLDER FLUX BEGINS
TO OOZE OUT, THEN USE TWEEZERS TO
POSITION THE IC.
Brand:LOUWEI
Product name:heat gun
Model:LW-HG01
Temperture Range:80-800C
Peak power:800W
Input voltage:AC220V/110V
Heating Element:Plug-in Heating Core
Airflow Range:10-100
Maximum airflow"240/MINUTE
Airflow type:Gentle centrifugal brushless fan
Product size:115mm*170mm*180mm
Package size:280mm*235mm*195mm
Product weight:2.14kg/2.46kg
