LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover

Save $2.97

Option: LW-HS3
Voltage: 110V US plug
Price:
Sale price$18.02 Regular price$20.99

Description

For removing chip glue and layering PCB boards, the Luowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate is ideal. The 65mm*100mm Luowei HS3 99W constant temperature control preheating platform is ideal for tinning, degumming, laminating, and other processes on a variety of mobile phone motherboards.

Features:
1. Material composition: composed of aluminium alloy used in aircraft. It guarantees effective heating coverage in addition to increasing durability.
2. Three-level insulation design: reduces heat loss and helps maintain the ideal temperature. greater performance during maintenance and increased energy efficiency.
3. Uniform heating: To avoid damaging delicate components when doing maintenance, a steady heat distribution is necessary.
4. Numerous applications: Ideal for jobs like temperature control, degumming, tinning, lamination, and motherboard layers, among others.
5. Effective and portable: Compact and lightweight. robust operation and accurate temperature regulation.
6. Easy to use: Able to display the device's status based on colour shifts.
7. Quick heating: 99W maximum power. No hot air gun soldering iron is required. heating uniformly.


Package List:
1 x Platform.
1 x Cable.

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