Description
Universal Adjustable temperature chip heating platform mini IC fixture for CPU WIFI EMMC SSD solder glue removal BGA reballing
Feature:
Free of hot air gun and soldering iron,easy to operate
Rapid temperature Rise preset 160-250C temperature range,one-button adjustment
Concealed screw, low voltage heating plate, support 5V/9V power supply
Aluminum substrate heat conduction faster and more efficient
it is suitable for removing glue and tin from CPU,RAM,eMMC,SSD,WIFI and other chips.
Product information
Brand:mijing
Weight:126g
Name:Chip glue removel table
Size:105*80*22mm
Model:MS1-Mini
Function:full fit design/adjustable temperature constart temperature heating/rapid heating air gun free/soldering iron heating
