XINZHIZAO Android system heating module suitable for XZZ L2023 Intelligent Heating Platform preheating table tinning bonding

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Color: rog7
Price:
Sale price$13.60 Regular price$21.60

Description

The XINZHIZAO L2023 is an intelligent heating table welding platform for repairing the motherboard, CPU, and IC camera of the iPhone X-16 PRO MAX. PCB separation installation tool for iPhone XZZ L2023 Intelligent Desoldering Station motherboard multilayer heating platform Oppo, Samsung, Huawei, and Redmi VIVO, Xiaomi, OnePlus, Nubia, IQOO, ROG, etc.

XZZ L2023 preheating desoldering station is the upgraded version of the Xinzhizao X360II preheating station. 

Option:
1. For iPhone X/11/12/13/14/15/16 Pro Max. 
2. For Huawei Mate 40 Pro, 50, 50 Pro/RS, P30 Pro, P50 Pro, Pro Pocket, P60.
3. For Samsung Galaxy S21+, S21 Ultra, S22, S22 Ultra, S23 ultra, S24 Ultra, S23, S23+.
4. For Xiaomi MI 12S, 12S Pro, 12S Ultra, 13 Pro.
5. For Redmi K30 Pro.
6. For Oppo Find N, Find N1 Flip, X5.
7. For VIVO X90 Pro.
8. For IQOO 10 Pro, 11 Pro.
9. For Nubia Z40S Pro.
10. For OnePlus 10 Pro, OnePlus 11.
11. For ROG 6, ROG 7.



Features:

The XZZ L2023 intelligent desoldering station has precise temperature control and no motherboard damage.
To avoid motherboard damage from overheating, the beeping alarm will activate when the predetermined temperature is achieved.
Good compatibility, a big operating area, support for larger motherboard desoldering procedures, and speed and convenience.

The temperature is always shown clearly, and it may be adjusted up or down.

characterised by rapid temperature rise, extended lifespan, consistent temperature, and low and rapid thermal complementary growth.

Support for continual upgrades for the Android and iPhone X-16 series motherboard lamination separation, screen bracket separation, etc.

Good compatibility, a big operating surface, support for Android phones, and an extra large heating area.

support for faster and more convenient larger motherboard desoldering operations An sophisticated desoldering station with a long lifespan and quick heating.

consistent temperature properties, and the air duct design's aesthetic appeal makes it more suitable for heat dissipation.

The motherboard fits better because to its innovative design, strong magnetic adsorption, built-in multiple strong magnetic components, no snaps, and a synthetic stone compression clasp.






 


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