The iPhone's logic board, also known as the motherboard, plays the role of the device's centerpiece, which integrates key components such as the processor, memory, and storage chips. This core component ensures effective communication between different hardware and is the foundation for smooth iPhone operation. If the logic board malfunctions, it can lead to a system crash or complete device failure, so it is crucial to have the right repair methods. Next, the method steps and key points of repairing the iPhone logic board using a heated platform will be described in detail.
First of all, you need to prepare a series of repair tools: including desoldering station, center frame ball placement platform, motherboard function test jig, tweezers, scribe, hot air gun, soldering iron, solder paste, as well as the main use of the heated platform and related auxiliary tools. These tools will help the repairer to safely and efficiently complete the soldering and separation of the logic board.
Next, temperature control is critical. The temperature setting of the heating platform needs to be maintained between approximately 150°C and 155°C to ensure that the solder melts without damaging the components. Overheating may result in distorted components or poor soldering. Before applying flux, it is important to make sure that each solder joint is adequately cleaned to enhance the quality and stability of the solder.
During the separation process, it is necessary to use a carving knife to gently clip the upper layer of the motherboard, a step that requires operational precision to avoid damage to the components. Subsequently, a soldering iron and soldering wick are used to remove residual solder from the two layers of pads to ensure a good connection during reassembly.
The functional test session is critical; before reassembly, the functionality of the layers must be checked using a test fixture to ensure that they start up properly. This step helps to verify the effectiveness of the repair work and avoid possible subsequent problems.
The rebound process is equally important; by using the reballing platform to load new solder balls onto the pads on the signal board, it is important to prevent excess solder from flowing into unwanted areas and to ensure that the solder joints are strong and will not come loose.
Finally, during the reassembly phase, the two layers need to be carefully aligned and heated (~130°C) to melt the solder balls and bond the two layers together without any gaps or misalignments in the process.
Commonly used heating platforms:
1. XZZ L2023 Intelligent Desoldering Station
XZZ L2023 preheating desoldering station is an upgraded version of the Xinzhizao X360II preheating station. XZZ L2023 intelligent desoldering station motherboard layered heating platform PCB separation installation tool is suitable for iPhone Huawei Samsung Oppo Xiaomi Redmi VIVO OnePlus Nubia IQOO ROG, etc.
2. Mechanic IX5 Ultra Preheating Platform
Mechanic IX5 Ultra Universal Preheating Platform for iPhone X-15 Pro Max motherboard delamination, bonding, dot matrix repair, degumming, etc.
To summarize, repairing an iPhone logic board using a heated platform is a complex but effective method that involves several key steps and technical points. By following the above recommendations, repairers can effectively solve all types of problems caused by a faulty logic board and ensure that the device is restored to its normal working condition.
